Assembling
Assembling
- manufacturing cells sized up to 400 mm х 600 mm, including the use of surface mounting technique;
- manufacturing of wire-wrap products (transformers, chokes)
- manufacturing of units and products sized up to 800 mm х 800 mm and 800 mm х 2000 mm
Surface Mount Technology (SMT) Equipment
A set of equipment for surface mounting of electronic components onto PCBs ensures the production of packaged electronic circuits of special-purpose class (class 3 according to IPC-A-610D standard) of any complexity level.Stencil-free printer MY500
 | Stencil-free printer MY500 manufactured by Swedish company MYDATA avtomation is the world’s first high-speed automatic machine for applying solder paste onto pads of a PCB using no stencils.
Stencil-free printer MY500 enables:
- depositing the solder paste onto pads of PCBs of any accuracy grade with high component density, including such elements as chips 01005 (0.4 mm х 0.2 mm), microcircuit chips with pitches 0.3 mm at the rate of 500 dots per second.
- ensuring unrivaled lead and changeover times.
|
The all-in-one high-speed pick-and-place system MY100DX-14 produced by Swedish company MYDATA avtomation features the following specifications:
 |
- The pick-and place speed is at least 27000 cph in accordance with IPC 9850 standard.
- The range of picked and placed electronic components:
- all existing chip components, including 01005 dimensioned 0.4 mm х 0.2 mm;
- ICs in any existing package, including SOIC, PLCC, TSOP, QFP, BGA, with the maximum package dimensions 56 mm х 56 mm;
- flip chip, surface mounted connectors and elements of customized shape.
|
Vapor-Phase soldering machine produced by ASSCON sistemtechnik (Germany)
 | Economical soldering system for highest technological requirements.
- Oxidation-free pre-heat and soldering process
- Homogeneous temperature distribution on the whole assembly
- Overheating of the solder product is impossible
- No shadowing or color selectivity
- Reproducible process conditions
- No time-consuming for generation of temperature profiles
- Low operating costs
- Universally useable for series and individual operation
- Lead-free capable without restriction
- ASB (automatic-solder-break), automatic recognition of the completed soldering process
- TGC (temperature-gradient-control), adjustable Temperature gradients in the pre-heating zone
- OPC (optical-process-control), visual process control
- Storage of soldering programs
|
Automated PCB Inspection YTV F1
 | YESTech’s advanced Thin Camera™ technology offers high-speed PCB inspection ( > 200,000 components per hour) with exceptional defect coverage.
With up to two top-down viewing cameras and four side viewing cameras, the F1-Series inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput. |
Selective Soldering Machine Orissa MPR
 | Designed for the increasing demands of large PCB manufacturers, flagship MPR (Multi Pot Rotate) series will process PCB's up to 610mm x 610mm (24"x24").
Equipped with the latest Pillarhouse technology, the revolutionary MPR offers a unique 360° rotating twin solder pot design providing maximum flexibility for a wide range of soldering applications
- IN-LINE OR STAND ALONE OPERATION
- NO TOOLING REQUIRED
- IN-LINE FLUXER OR PRE-HEATER AVAILABLE
- FIDUCIAL CORRECTION
- TOPSIDE PRE-HEAT WHILE SOLDERING
- TWIN QUICK RELEASE BATHS |
YTX-3000 X-Ray
 | The YTX-3000 x-ray system offers EMS providers and semiconductor packagers a superior yield enhancement solution to reduce costs, improve quality and increase throughput.
The YESTech YTX-3000 provides users with a high-resolution x-ray capability in a flexible, compact maintenance free configuration. The YTX-3000 is available with a 4 or 5 axis sample manipulator and a 15" x 20" (380mm x 508mm) x-y travel for samples up to 5 pounds in weight. Full 360 degrees of rotation and 30 degrees of tilt are available. Stepper motor drives provide a wide range of motion from ultra-slow use at high magnifications, to high speed for travel over large distances. All systems come with a unique control module and programmable motion for automated inspection.
The YTX-3000 comes with YESTech's proprietary machine vision technology for fully automated inspection of BGA and flip chip devices. Other optional inspections include die attach, bond wire and correct assembly verification. |
MS9000SAN Rework Station
 | MS9000SAN is the all-round rework system which almost all SMD can be reworked. And the original ITTS auto profiler system is operates of the system easily and exactly. Many kinds, such as a connector, and a socket, a shield cover, of SMD can be reworked as well as BGA and CSP, and also QFP of a fine pitch.
Automatic Thermal Profile System
ITTS(Intelligence Thermal Trace System)
High performance combination heating system
Powerful 6 zones heating system
Standard split screen zoom for easy alignment of large components
User Friendly touch screen operation System
For global use, it can change to four languages. (English/Japanese/China/Korea)
Built-in 3+1 CH Temperature profile monitor
Optimal for Lead Free Solder. |
PCB Cleaner: NC25
 | Specially designed to enhance VIGON® MPC® system (Micro Phase Cleaning), PCBs are first immersed in a washing tank where they undergo the combine action of a vertical shaking and a turbulent bubbly air flow that allows reaching a high efficiency level. Boards are then transferred in a DI Water rinsing tank and are finally dried in a vacuum tank. Between each transfer, PCBs go through an air knife in order to limit the fluid exchange from a tank to another. The easy mechanical system confers to this equipment a very high reliability.
The use of an aqueous product (No flash point, low VOC content) that makes it possible to separate the residues, ensures a 100% closed loop cleaning process to meet today’s economic and environmental demands.. |
Back to the list